SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve joint position accuracy by minimizing the accumulated pitch size deviation of a tape carrier for the joint of a semiconductor chip. SOLUTION: The semiconductor device is provided with a base material 12 formed of a tape including a device hole 12b, a plurality of wiring electrodes 12a which are extended toward the device hole 12b and formed on the surface of the base material 12, and a semiconductor chip 11 allocated in the device hole 12b and electrically connected to a plurality of wiring electrode 12a. The plurality of wiring electrodes 12a are inclined to widen an interval as the side of device hole 12b shifts to the end from the center thereof. Accordingly, joint reliability can be improved because the wiring electrode 12a and semiconductor chip 11 can be connected with the minimum deviation of a joint position even when the accumulated pitch size of the wiring electrode 12a is varied. COPYRIGHT: (C)2004,JPO&NCIPI