| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module having a base plate or a casing for a power semiconductor module directly mounted on a cooled body. <P>SOLUTION: The casing (10) encloses an electrical insulating substrate having an arrangement of connecting lane and a power semiconductor element, and is further composed of a cover and at least one frame-like casing part forming a sidewall. This casing part is composed of a main frame (120) and at least one fixed frame (130), and then the main frame (120) includes guides (122, 128) for accepting terminal elements (30, 32) by the main frame (120). The fixed frame (130) is arranged on the main frame (120) so that this fixed frame (130) is at least partially mounted on the terminal brackets (310, 320) of the terminal elements (30, 32) for preventing the movement of the terminal elements (30, 32) in the direction of the substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
