发明名称 |
RADIATOR AND ITS PRODUCING PROCESS, SUBSTRATE FOR POWER MODULE, POWER MODULE |
摘要 |
PROBLEM TO BE SOLVED: To reduce the weight while enhancing machinability, and to attain a sufficient strength while preventing warp. SOLUTION: The radiator 16 is formed by integrating powder of a low thermal expansion material 17 having characteristics of small thermal expansion coefficient, and powder of a metal high heat conducting material 18. The low thermal expansion material 17 is an iron-nickel based alloy, e.g. Invar alloy. The high heat conducting material 18 is composed of a material having a high thermal conductivity, e.g. Cu or its alloy. COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004200567(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020369847 |
申请日期 |
2002.12.20 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
NAGASE TOSHIYUKI;NEGISHI TAKESHI;NAGATOMO YOSHIYUKI |
分类号 |
H01L23/36;H01L23/373;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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