| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed board which can easily realize high density of interconnection and also advantageously realize suppression of the generation of peeling and cracks, the prevention of metal ion from diffusing in a filling material, and the prevention of the filling material from eroded by laser beam. <P>SOLUTION: The multilayer printed board has a structure, in which a conductor circuit is formed on a substrate through a resin interlayer dielectric layer, and a through-hole is provided in the substrate and is filled with the filling material. In an inner wall of the through-hole, a coarsening layer is formed. More desireably, a conductor layer, which covers the surface in which the filling material is exposed from the through-hole, is formed directly above the through-hole. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
