CIRCUIT BOARD STRUCTURE, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To improve a circuit board structure technique, and to provide a high-density wiring pattern, and a manufacturing method for a circuit board structure that can efficiently and simply manufacture it. SOLUTION: The circuit board structure includes a first circuit board 11 that includes an opening 21, a second circuit board 13 that is connected to it and includes the opening 21 which is in a state of matching to the opening 21, and conductive paste 25 that perfectly fills the opening 21 and only partly fills the opening 21 of the first circuit board 11. COPYRIGHT: (C)2004,JPO&NCIPI