| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board wherein a plurality of bonding wires for connection of a large current can be reliably connected at predetermined positions of wiring conductors, and which is excellent in the reliability of airtight sealing of an electronic component. SOLUTION: The wiring board 3 includes an insulating substrate 1 having a recess 1a for mounting and accommodating an electronic component 4 on and in its upper surface, and wiring conductors 2 connected with bonding wires 6 connected to electrodes 5 of the component 4 at sites exposed to the inner periphery of the recess 1a. One of the wiring conductors 2 which is to be connected with a plurality of the bonding wires 6 has a tip end which is divided into a plurality of tip end sections 2a like a comb, to which the bonding wires 6 are connected respectively. Consequently, the plurality of bonding wires 6 can be reliably connected to the ends of the conductors 2 and an adhesion failure to the recess 1a can be effectively prevented. COPYRIGHT: (C)2004,JPO&NCIPI
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