发明名称 HEAT RADIATOR OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a highly efficient heat radiator which increases the frequency of heat exchange between cooling air and an electronic component. SOLUTION: The heat radiator lowers the temperature of an electronic component, and comprises a first fan 22, a second fan 24 and three fins 26, 28, 30. The first fin is connected to the electronic component by a heat pipe and lowers the temperature by using air flow blown off by the first fan. The second fin is connected to an electronic component by a heat pipe and lowers the temperature by using air flow blown off by the second fan. The third fin is closely connected to a heat source of the electronic component and is positioned between the first fan and the second fan and lowers the temperature by using intensified air flow by series of both the fans. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200642(A) 申请公布日期 2004.07.15
申请号 JP20030188026 申请日期 2003.06.30
申请人 ARIMA COMPUTER CORP 发明人 CHIOU ING-JER
分类号 G06F1/20;H01L23/467;H05K7/20;(IPC1-7):H01L23/467 主分类号 G06F1/20
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