ELECTROLYTIC TREATMENT DEVICE, AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To perform CMP (Chemical Mechanical Polishing) working in a short time by improving the flatness of a plating film even if fine grooves and large grooves are coexistent on the surface of a substrate. SOLUTION: The electrolytic treatment device is provided with: a substrate holding part 36 for holding a substrate; a first electrode 88 for supplying electric currents to the treatment face of the substrate; and an electrode head 28 having a second electrode 98 and a high resistance structure 110 arranged so as to be confronted with the substrate holding part 36 in order, and a polishing face 120a arranged at a position facing the substrate W held by the substrate holding part 36. The electrolytic treatment device is further provided with: an electrolytic solution injecting means of injecting an electrolytic solution into the space between the substrate held by the substrate holding part 36 and the second electrode 98; a relative movement mechanism of relatively moving the substrate holding part 36 and the electrode head 28; a pressing mechanism 122 of pressing the polishing face 120a of the electrode head 28 against the substrate W held by the substrate holding part 36; and a power source 114 of applying voltage in such a manner that the direction of the electric current is selectively switched between the first electrode 88 and the second electrode 98. COPYRIGHT: (C)2004,JPO&NCIPI