| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which is capable of downsizing, height lowering, and high-density mounting, and provides a high reliability in respect to the installation of an optical semiconductor element. SOLUTION: The optical semiconductor device comprises a frame body 2 which consists of an insulator in the shape of a square frame and in which a projection 2b projected from the internal perimeter is made inside the upper part and an electrode pad 5 at the bottom of the projection 2b, an optical semiconductor element 3 which has a light receiving part 3a at the center of the topside and whose flank is bonded to the internal perimeter of the frame body 2 and on which an electrode 4 arranged around the light receiving part 3a is electrically connected to the electrode pad 5, and a translucent cover 8 which is bonded to the topside of the frame body 2 via a resin layer 7. COPYRIGHT: (C)2004,JPO&NCIPI
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