| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali-developable positive photosensitive resin precursor composition having small shrinkage during curing and high heat resistance. <P>SOLUTION: The positive photosensitive resin precursor composition contains (a) a polymer consisting mainly of a structural unit expressed by formula (1); (b) a compound having a phenolic hydroxyl group expressed by formula (2); and (c) an esterified quinone diazide compound. In formula (1), R<SP>1</SP>represents a ≥2C organic group having the valance from 2 to 8, R<SP>2</SP>represents a ≥2C organic group having the valance from 2 to 6, and each p and q represents an integer from 0 to 4 satisfying p+q>0. In formula (2), R<SP>4</SP>represents a hydrogen atom or a 1-20C organic group, R<SP>5</SP>represents one of a hydrogen atom, a hydroxyl group and 1-20C organic groups, a represents an integer from 0 to 3, b represents an integer from 2 to 6, and c represents an integer from 0 to 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
