发明名称 IMAGE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a structure of an image sensor which can be produced conveniently while reducing a production cost. SOLUTION: The image sensor comprises a substrate, a protruding fringe layer provided on the substrate to form a containing chamber together with the substrate and having at least one exhaust hole communicating with the containing chamber, an image sensing chip located in the containing chamber on the substrate, a plurality of lead wires for connecting the image sensing chip electrically with the substrate, a translucent layer provided on the protruding fringe layer, and a medium filling the exhaust hole of the protruding fringe layer and sealing the containing chamber hermetically. When the translucent layer is secured onto the protruding fringe layer, pressure in the containing chamber is discharged from the exhaust hole and the translucent layer is secured rigidly onto the protruding fringe layer. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200628(A) 申请公布日期 2004.07.15
申请号 JP20030027305 申请日期 2003.02.04
申请人 KINGPAK TECHNOLOGY INC 发明人 SHIE JR-HUNG;GO SHISEI;CHEN BING-GUANG;CHIOU SHIOU-SHIN;LIU JIAN-SHIAN;JANG WEN-YANG
分类号 H01L27/14;H01L23/02;H01L31/0203;H01L31/14;H04N1/028;H04N5/335;(IPC1-7):H01L27/14 主分类号 H01L27/14
代理机构 代理人
主权项
地址