发明名称 FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce an incubation time for forming a film, in a method for forming a metallic film through a CVD process using a metal carbonyl as a raw material. SOLUTION: The method for forming the metal film by using a metal carbonyl compound as a raw material comprises the first step of introducing a reactive gas into a space in the proximity of the surface of a substrate to be treated, and the second step of introducing a vapor-phase raw material containing the metal carbonyl compound into the space on the surface of the substrate, after the first step, to deposit a metal film on the surface of the substrate, wherein in the first step, the metal film is substantially inhibited from depositing on the substrate. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004197163(A) 申请公布日期 2004.07.15
申请号 JP20020367073 申请日期 2002.12.18
申请人 TOKYO ELECTRON LTD 发明人 YAMAZAKI HIDEAKI;HATANO TATSUO;KOUNO YUMIKO
分类号 C23C16/18;C23C16/02;C23C16/16;C23C16/455;H01L21/28;H01L21/285;(IPC1-7):C23C16/18 主分类号 C23C16/18
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