ENCAPSULATED MICROSTRUCTURE AND METHOD OF PRODUCING ONE SUCH MICROSTRUCTURE

摘要

The invention relates to an encapsulated microstructure and to a method of producing one such microstructure. The inventive microstructure comprises a first layer which is insulated from a substrate (6) by an insulting layer (7), said first layer containing: at least one sensitive element (1) which is connected to at least one contact pad (3) by means of an electrical connection (2) and which is protected by a cap (5). According to the invention, the sensitive element (1), the electrical connection (2) and the contact pad (3) form an assembly (10) that is defined in the first layer by at least one channel (11), said assembly (10) being covered by the cap (5). The cap (5), which comprises at least one opening (12) above the contact pad (3), is solidly connected to (i) the contact pad (3) at the periphery of the opening (12) and (ii) an area (9) located beyond the channel (11) in relation to the assembly (10). The invention is suitable for micro-electro-mechanical structures.