SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip in which a plurality of element-forming layers formed as a thin film are integrated by using a transfer technology.

SOLUTION: The element-forming layer of a film thickness 50μm or smaller once separated from a substrate is transferred to the other substrate by using the transfer technology. Furthermore the element-forming layer of a film thickness 50μm or smaller separated from the other substrate is repeatedly transferred to be superimposed thereon, thereby forming a semiconductor chip which obtains the formation of a thinner film and higher integration than that of a prior art mounted in a three-dimensional manner.

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