| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solventless thermosetting resin composition, which is excellent in workability such as casting because it is liquid of low viscosity at room temperature(25°C) and gives, after curing, a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, a method for producing the same and its product. <P>SOLUTION: Essential components of the thermosetting resin composition are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by formula (2) (wherein A is a bivalent organic group having at least two carbon atoms) and a curing agent(d). <P>COPYRIGHT: (C)2004,JPO&NCIPI |
