| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of certainly mounting a reliable semiconductor device by preventing a short-circuiting between chip components, such as a semiconductor chip, and at the same time by reliably bending a flexible wiring board for fixation. <P>SOLUTION: The semiconductor device is provided with a base material made of a flexible film, the flexible wiring board 1 having a wiring pattern 4 formed on the substrate of the base material, and first and second semiconductor chips mounted onto the flexible wiring board so that they are connected to the wiring pattern, and it is characterized in that the flexible wiring board is bent and the upper surfaces of first and second semiconductor chip 6a, 6b come into contact via an adhesive layer having adhesive properties in a room temperature for fixing. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
