| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of producing a surface acoustic wave (SAW) device which is highly reliable and can be miniaturized and produced at a low cost by surely sealing a mounting substrate and a SAW element by a resin film, and the SAW device. <P>SOLUTION: A SAW element 2 is mounted onto a mounting substrate 1 having an external terminal 7 via a bump 3 by flip chip bonding, the SAW element 2 is then covered with a resin film 10, and the periphery of the SAW element 2 mounted on the mounting substrate 1 is covered with a part of the resin film 10 so that the SAW element 2 is sealed. The resin film 10 is hardened. Thus, the SAW device is provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
