| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus which performs an interruption processing by interrupting operation and can continue the interrupted treatment after the interruption processing. SOLUTION: The vacuum treatment apparatus comprises, a stop means for interrupting an automatic operation of wafer treatments during treating a wafer having a predetermined conveying order; and a control means for treating the wafer even after interrupted the automatic operation by the stop means, for stopping the wafer treatments after starting the interrupting operation of the wafer, for sampling the wafer for interruption by a conveying system 8 and conveying the wafer to a vacuum treatment chamber via switchable chambers 3 and 4, for returning the treated wafer for interruption to a starting cassette via the switchable chambers 3 and 4, and the conveying system 8, and for restarting to convey the wafer having a predetermined conveying order after the all wafer treatments for interruption are completed. COPYRIGHT: (C)2004,JPO&NCIPI
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