| 摘要 |
PROBLEM TO BE SOLVED: To reduce the area of a disposal substrate when manufacturing a printed-wiring board assembly for performing the multiple machining of a printed-wiring board. SOLUTION: The printed-wiring board assembly 1 comprises two printed-wiring boards 3a, 3b and the disposal substrates 6a, 6b. There is a perforation 2 (cutting line) between the printed-wiring boards 3a, 3b and the disposal substrates 6a, 6b. A recognition mark 5 for correcting a position is arranged on the joint 4 (a place where the cutting line is intermittent) of the perforation 2, thus narrowing width d<SB>5</SB>, d<SB>7</SB>, and d<SB>9</SB>of the disposal substrates 6a, 6b and hence reducing the area of the disposal substrates 6a, 6b, narrowing a pitch d<SB>1</SB>between the printed-wiring boards 3a and 3b and entire width d<SB>3</SB>of the printed-wiring board assembly 1, and reducing production costs. COPYRIGHT: (C)2004,JPO&NCIPI
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