发明名称 |
MULTILAYERED CERAMIC SUBSTRATE FOR INTEGRATED POWER COMPONENTS AND METHOD FOR THE PRODUCTION OF SAID SUBSTRATE |
摘要 |
The invention relates to a ceramic substrate (1) consisting of a multilayered structure, comprising electric interconnections and integrated components, characterized in that it also comprises at least one cavity (2) filled with a conductive deposit (3) on at least one portion of the depth thereof, said conductive deposit consisting of a heat sink for receiving a power component. Advantageously, the conductive deposit is electrolytically obtained at low cost in a collective manner. The invention also relates to a module integrating a power component at conductive-deposit level, in addition to the electronic circuit wherein the module is associated with a printed circuit. |
申请公布号 |
WO03077313(A3) |
申请公布日期 |
2004.07.15 |
申请号 |
WO2003FR00743 |
申请日期 |
2003.03.07 |
申请人 |
THALES;HENQUENET, PASCAL;BERTINET, JEAN-PIERRE |
发明人 |
HENQUENET, PASCAL;BERTINET, JEAN-PIERRE |
分类号 |
H01L21/48;H01L23/367;H01L23/66;H05K1/02 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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