| 发明名称 |
Integrated circuit manufacturing method of chip scale package, involves attaching solder balls in area that is uncovered by resist element, of patterned rewriting element, in patterned form |
| 摘要 |
Integrated circuit (14) is mounted upside down on carrier (10), such that connection element (15) contacts with insulator (17), through the hole of carrier. Patterned rewriting elements (18, 19) attached in insulator, are internally connected by patterned solder resist element (20). Solder balls (22) are attached in area that is uncovered by resist element, of rewriting element, in patterned form. An Independent claim is also included for integrated circuit.
|
| 申请公布号 |
DE10255844(B3) |
申请公布日期 |
2004.07.15 |
| 申请号 |
DE2002155844 |
申请日期 |
2002.11.29 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HEDLER, HARRY;MEYER, THORSTEN;IRSIGLER, ROLAND |
| 分类号 |
H01L23/12;H01L21/60;H01L23/31;(IPC1-7):H01L21/60;H01L23/50 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
