| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide inexpensive light receiving sensors for short wavelengths and allowed to be mass-produced. <P>SOLUTION: A light receiving sensor 1 is provided with a substrate 2, a semiconductor IC 3 including at least a light receiving element formed on the substrate 2, a 1st peripheral wall 9 formed so as to surround the periphery of the semiconductor IC 3, a 2nd peripheral wall 10 formed so as to surround the outer periphery of the 1st peripheral wall 9, and a glass plate 11 formed in parallel with the substrate 2 and the semiconductor IC 3 is air-tightly sealed in a hollow state by the substrate 2, the 1st peripheral wall 9 and the glass plate 11. The precision of a distance between the substrate 2 and the glass plate 11 can be determined by the 1st peripheral wall 9. In addition, UV curing resin is used for the 2nd peripheral wall 10. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
