| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed-wiring board for avoiding the separation of a solder ball bump from an electrode land even if stress is applied in a traverse direction. <P>SOLUTION: In the printed-wiring board 1 having an electrode land 20 where the solder ball bump 41 is joined, a columnar projection 21 is provided at the electrode land 20, and stress in a traverse direction marked by an arrow a1 is absorbed not only by the interface between the solder ball bump 41 and the electrode land 20, but also a side 21a in a projection 21. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
