| 摘要 |
PROBLEM TO BE SOLVED: To prevent a heating process from having a thermal effect on an electronic component up to the interior thereof when a connection conductive layer of a Pb free Sn based alloy plating layer formed on the surface of an external terminal in order to suppress generation of whisker is melted. SOLUTION: In the process for producing an electronic component, an Sn-Bi alloy plating layer constituting a connection conductive layer 8 formed on the surface of a lead 2 is melted by immersing it, for a very short time of 0.2-5 sec, into a fluorine based inactive chemical liquid heated at 220-280°C which is higher than the melting point of the Sn-Bi alloy plating layer. COPYRIGHT: (C)2004,JPO&NCIPI |
