发明名称 METHOD OF LAMINATING DRY FILM
摘要 PROBLEM TO BE SOLVED: To provide a laminating method which can prevent mutual adhesion of adjacent copper-clad laminates with a dry film, and which also can prevent a resist layer not covered by a cover film and exposed in the periphery of the dry film from being separated from the copper-clad laminate and becoming a foreign matter followed by an exposure process eventually causing a defective product. SOLUTION: In this method of laminating a dry film, the periphery 11 of the dry film 1 on the copper-clad laminate 5 which has been subjected to thermocompression bonding by a laminate roll is more rapidly cooled than the central portion 12 of the dry film 1 and is cooled until the temperature becomes 50°C or below. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200425(A) 申请公布日期 2004.07.15
申请号 JP20020367476 申请日期 2002.12.19
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HOASHI JUNICHI
分类号 B29C65/02;B29L9/00;B29L31/34;H05K3/06;(IPC1-7):H05K3/06 主分类号 B29C65/02
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