| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a microstructure on a semiconductor substrate. SOLUTION: This method uses a combination of photolithography masking technique and micro-contact printing. This method is composed of a step of preparing a mask 10, a step of manufacturing a soft stamp 16 from a master containing a microstructure, a step of fitting the soft stamp 16 to the mask 10, a step of marking a desired pattern on a resist layer 26 on a substrate 24, a step of hardening the pattern by UV light 28, and a step of plating the hardened resist on the mask with metal. COPYRIGHT: (C)2004,JPO&NCIPI
|
