发明名称 COATING DEVICE AND COATING FILM FORMING METHOD
摘要 <p>A resist coating unit (COT) comprises a spin chuck (41) for holding a wafer supplied with a resist liquid, and a processing cup (50) for storing the spin chuck (41) and discharging the atmosphere around a wafer (W) through the bottom. The processing cup (50) includes a first cup (51) having an outer peripheral wall (61a), and an air current control member (52) disposed inside the first cup (51) in the close proximity to the wafer (W) so as to surround the wafer (W). The air current control member (52) has a substantially quadrangular cross section, composed of an upper ring member (62a) substantially triangular in cross section and upwardly convex, and a lower ring member (62b) substantially triangular in cross section and downwardly convex, and forms an exhaust channel (55) between the outer peripheral wall (61a) and the air current control member (52) for discharging the atmosphere substantially around the wafer (W).</p>
申请公布号 WO2004059709(A1) 申请公布日期 2004.07.15
申请号 WO2003JP16154 申请日期 2003.12.17
申请人 SHITE, HIDEO;TOKYO ELECTRON LIMITED 发明人 SHITE, HIDEO
分类号 B05C11/08;G03F7/16;H01L21/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 B05C11/08
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