发明名称 Laminate comprised of flat conductor elements
摘要 A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the first support substrate and the second support substrate and a link area that connects a solder shunting area with the first solder pad, wherein the link area is narrower than the first solder pad and the solder shunting area.
申请公布号 US2004134684(A1) 申请公布日期 2004.07.15
申请号 US20040471464 申请日期 2004.02.20
申请人 RISSING LUTZ;FISCHER PETER 发明人 RISSING LUTZ;FISCHER PETER
分类号 H05K3/34;H05K1/11;H05K1/14;H05K3/36;(IPC1-7):H05K1/11;H01R12/04 主分类号 H05K3/34
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