发明名称 ALIGNMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively prevent damage to a work in rotation of a table or the like by restraining drooping and vertical flopping in an outer circumferential region of the work, to detect an outer circumferential position of the work stably and to align a central position with an orientation mark of the work highly precisely even if the work cannot keep a plane shape. SOLUTION: The alignment device 10 comprises a table 11 with a mounting surface 12A which is rotatably provided in-plane and can suck a wafer W, a transfer means 30 for transferring the table 11 in X and Y directions and a sensor 50 for detecting an outer edge position of the wafer W. The mounting surface 12A is placed on the inside of an outer circumference of the wafer W. Meanwhile, a support member 15 which is located in almost the same plane as the mounting surface 12A is provided outside the table 11. The supporting member 15 has a plane shape which is larger than that of the wafer W. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200643(A) 申请公布日期 2004.07.15
申请号 JP20030203526 申请日期 2003.07.30
申请人 LINTEC CORP 发明人 KUROKAWA HIDEJI
分类号 B23Q17/24;B23Q1/52;B23Q3/18;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B23Q17/24
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