| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which reduces the layout restraint related to heat generating elements and has high degrees of freedom for circuit design, and reduces the heat influence on the peripheral elements of the heat generating elements, and to provide its manufacturing method. <P>SOLUTION: The multilayer substrate is formed by laminating a plurality of resin films composed of a thermoplastic resin, and a metal plate 30p is inserted into a part of a resin base metal 1p, formed by mutually pasting the plurality of resin films. A part of the metal plate 30p is exposed from the resin base metal 1p, and also the heat generating elements 2 are disposed on the surface of the resin base metal 1p at the portion, into which the metal plate 30p is inserted. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
