| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for soldering improved in cooling efficiency. SOLUTION: The upper side and lower side of a work W are provided with an upper cooling nozzle 32 and a lower cooling nozzle 57. The upper side and lower side in the side directions of the work W are provided with an upper suction port 34, an upper recovery port 36, a lower recovery port 37 and a lower suction port 38 forcedly sucking an atmosphere and recovering the same. The atmosphere whose temperature is raised by being sprayed on the work W by the upper cooling nozzle 32 and lower cooling nozzle 57 is sucked by the upper suction port 34, upper recovery port 36, lower recovery port 37 and lower suction port 38. Cold air is not stayed in the vicinity of the work W, but is efficiently exhausted, and fresh cold air is successively fed to the work W, so that the cooling efficiency of the work W can be improved. COPYRIGHT: (C)2004,JPO&NCIPI |
