| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device or the like, its device, an inspection method and its device, capable of stabilizing a manufacturing process, and automatizing an inspection correction process. SOLUTION: This device is constituted of an automatic inspection unit 1 for extracting a defect based on an inspection standard of an inspection object set beforehand, a unit 2 for receiving information on the defect extracted and acquired by the inspection unit 1, classifying the the defect kind based on similarity of the defect and outputting the result, and extracting the feature variable on the defect based on the classified result, and a unit 3 for converting the feature variable into the inspection standard of the inspection unit 1, performing feedback of the converted inspection standard to the automatic inspection unit 1, and adjusting the automatic inspection unit 1. COPYRIGHT: (C)2004,JPO&NCIPI
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