发明名称 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece
摘要 Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly. The cleaning electrode may be disposed along a position of the motion path that is beyond the range of motion required to process the microelectronic workpiece so that the programmable controller may be programmed to conduct a cleaning cycle while a microelectronic workpiece is present in the reactor for processing.
申请公布号 US2004134774(A1) 申请公布日期 2004.07.15
申请号 US20030745190 申请日期 2003.12.23
申请人 WOODRUFF DANIEL;EUDY STEVE;ERICKSON JAMES;OBERLITNER THOMAS;EGLOFF MATTHEW 发明人 WOODRUFF DANIEL;EUDY STEVE;ERICKSON JAMES;OBERLITNER THOMAS;EGLOFF MATTHEW
分类号 C25D5/00;C25D7/00;C25D7/12;C25D17/00;C25D21/10;H01L21/00;(IPC1-7):C25D17/00 主分类号 C25D5/00
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