Interface for UV-curable adhesives

摘要

In an embodiment of this invention, an adhesion layer is deposited on an encapsulation lid to provide strong adhesion with the UV-curable adhesive in order to improve encapsulation of an organic electronic device. The adhesion layer is comprised of a metallic layer or a ceramic layer that is thin enough to be nonopaque and thick enough to provide stronger adhesion at an interface with said UV-curable adhesive than said encapsulation lid.