发明名称 |
SURFACE-MOUNTED MICROWAVE PACKAGE AND CORRESPONDING MOUNTING WITH MULTILAYER CIRCUIT |
摘要 |
The hyperfrequency unit has a volume with an outer Faraday cage formed from a surface conductor. There is a connection point outside the Faraday cage and an input/output across the cage. There is a base forming a unit face with an outer surface forming a mounting surface to apply on the outer unit. |
申请公布号 |
AU2003299214(A1) |
申请公布日期 |
2004.07.14 |
申请号 |
AU20030299214 |
申请日期 |
2003.12.08 |
申请人 |
THALES |
发明人 |
PHILIPPE KERTESZ;BERNARD LEDAIN;DANIEL CABAN-CHASTAS |
分类号 |
H01L23/552;H01L23/66;H05K1/02;H05K3/34 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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