发明名称 SURFACE-MOUNTED MICROWAVE PACKAGE AND CORRESPONDING MOUNTING WITH MULTILAYER CIRCUIT
摘要 The hyperfrequency unit has a volume with an outer Faraday cage formed from a surface conductor. There is a connection point outside the Faraday cage and an input/output across the cage. There is a base forming a unit face with an outer surface forming a mounting surface to apply on the outer unit.
申请公布号 AU2003299214(A1) 申请公布日期 2004.07.14
申请号 AU20030299214 申请日期 2003.12.08
申请人 THALES 发明人 PHILIPPE KERTESZ;BERNARD LEDAIN;DANIEL CABAN-CHASTAS
分类号 H01L23/552;H01L23/66;H05K1/02;H05K3/34 主分类号 H01L23/552
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