CURABLE ORGANIC RESIN COMPOSITION

摘要

A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X-R¹-Si(OR²)nR³_3-n, wherein X is NCS- or SCN-, R¹ is an alkylene or alkyleneoxyalkylene group, R² and R³ are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.