发明名称 |
PRECISION BOND HEAD FOR MOUNTING SEMICONDUCTOR CHIPS |
摘要 |
The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface. |
申请公布号 |
EP1436828(A2) |
申请公布日期 |
2004.07.14 |
申请号 |
EP20020775932 |
申请日期 |
2002.09.20 |
申请人 |
LILOGIX, INC. DOING BUSINESS AS RD AUTOMATION |
发明人 |
BENDAT, ZVI;ZEIGERMAN, FELIX |
分类号 |
H01L21/60;H01L21/00;H01L21/52;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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