发明名称 Multi-band multi-layered chip antenna using double coupling feeding
摘要 Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.
申请公布号 GB0412869(D0) 申请公布日期 2004.07.14
申请号 GB20040012869 申请日期 2004.06.09
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人
分类号 H01Q13/08;H01Q;H01Q1/24;H01Q1/36;H01Q1/38;H01Q5/00;H01Q5/01;H01Q9/04;H01Q9/42;H01Q23/00 主分类号 H01Q13/08
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