ELECTRONIC DEVICE EQUIPPED WITH HIGH EFFICIENCY COOLING TOOL

摘要

PURPOSE: An electronic device equipped with a high efficiency cooling tool is provided to minimize a temperature difference of each area on one memory module by uniformly cooling the memory module regardless of an installation position of the memory module and reduce a size for installing the memory module by making the cooling tool through a semiconductor manufacturing process. CONSTITUTION: The first cooling tool(50) has a mold or case shape covering entire memory module and the same length as the memory module. The first cooling material is made of aluminum. When the first cooling tool is installed to the memory module, the memory chips installed to both sides of the memory module are covered by the first cooling tool. A height of a slot(52) that is the space inserted by the memory module is at least equal to a value summing the height of the memory chip and a gap between the memory chip and an upper end of the memory module. Two surfaces contacting to the memory chips installed to both sides of the memory module are connected to an upper side of the memory module.