RESISTOR FOR FUEL CELL USED IN HEATING A SOURCE SUBSTANCE FOR THE GENERATION OF HYDROGEN OR OTHER GAS FOR FUEL CELLS, AND ITS MANUFACTURING METHOD

摘要

PURPOSE: Provided are methods for fabrication of resistors used in heating a source substance for the generation of hydrogen or other gas for fuel cells, and apparatus fabricated by such methods. CONSTITUTION: The method for fabricating a heater assembly for generation of gas comprises the steps of (a) providing a suitable first substrate layer; (b) bonding to the first substrate layer a second substrate layer, the second substrate layer bearing a resistive heating element and conductive traces electrically coupled to the resistive heating element; (c) if necessary, bonding to the second substrate layer a hydrophobic layer; and (d) bonding a top layer to the optional hydrophobic layer if present and otherwise bonding the top layer to the second substrate layer, the top layer including manifolding for the gas, thus completing the resistive heater assembly. The resistive heater assembly (10) for heating a source substance for generation of gas from the source substance comprises (a) a chamber (100) for containing the source substance, the chamber including an aperture (110); (b) a thin resistive heating element (40) disposed to be immersed in the source substance, the thin resistive heating element being suspended across the aperture; and (c) conductive traces (50) electrically coupled to the thin resistive heating element. The resistive heater assembly (10) for heating a source substance for generation of gas from the source substance comprises (a) a first substrate layer (20); (b) a second substrate layer (55), a resistive heating element, and conductive traces electrically coupled to the resistive heating element, the second substrate layer bearing the resistive heating element and the conductive traces, and the second substrate layer being bonded to the first substrate layer; (c) an optional hydrophobic layer (60) bonded to the second substrate layer; and (d) a top layer (70) bonded to the optional hydrophobic layer if present and otherwise bonded to the second substrate layer, at least one layer of the heater assembly including manifolding (80) for the gas.