发明名称 Semiconductor device and method for fabricating the same
摘要 An Si/SiGe layer including an Si buffer layer, an SiGe spacer layer, a graded SiGe layer and an Si cap layer is epitaxially grown in a region corresponding to a collector opening while a polycrystalline layer is deposited on the upper surface of a nitride film, and side surfaces of an oxide film and the nitride film. In this case, the Si buffer layer is formed first and then other layers such as the SiGe spacer layer are formed, thereby ensuring non-selective epitaxial growth. Then, a polycrystalline layer is deposited over the nitride film.
申请公布号 US6762106(B2) 申请公布日期 2004.07.13
申请号 US20020326059 申请日期 2002.12.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 AOKI SHIGETAKA;SAITOH TOHRU;NOZAWA KATSUYA
分类号 H01L21/20;H01L21/205;H01L21/331;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06;H01L29/10;H01L29/732;H01L29/737;(IPC1-7):H01L21/331 主分类号 H01L21/20
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