Ball assignment for ball grid array package

摘要

A printed circuit board having contacts in a contact array of rows and columns. Groups of n columns of the contacts are electrically connected to n-1 columns of vias disposed interstitially in a via array between the n columns of the contacts. A major vertical routing channel is formed between adjacent groups of n columns of the contacts and the n-1 columns of vias. First electrical traces are electrically connected to a first number of the vias. The first electrical traces are routed to an outside edge of the via array through the major vertical routing channel.