| 摘要 |
A method for forming semiconductor device packages including one or more semiconductor dice, leads in communication with bond pads of the dice, and a protective layer, or package, over at least the active surfaces of the semiconductor dice. The protective layer covers at least the bond pads, the proximate regions of the corresponding leads, and the conductive elements between the bond pads and their corresponding leads. The leads are at least electrically exposed through the protective layer. A portion of each lead may be physically exposed through the protective layer so as to facilitate connection of each lead to external circuitry. The packages may also include protective layers over the back sides or the edges of the semiconductor dice. A stereolithographic process is used for precisely forming the protective layers of the package. A machine vision system is used in connection with stereolithographic equipment to locate individual dice, features thereof, or leads. Openings are integrally formed in the protective layer over the active surface to facilitate the connection of external conductive structures to the leads. The completed CSP device is precisely encapsulated with minimal lateral dimensions, and has an array of precisely positioned external connectors.
|
