IMAGE SENSOR AND FABRICATING METHOD THEREOF

摘要

PURPOSE: An image sensor is provided to reduce the size of an image sensor and simplify the structure of the image sensor, by attaching and fixing an interval maintaining substrate having a space part in its center to the bottom of a light transmission substrate and by forming a bump layer on the bottom surfaces of the inside and the outside of the interval maintaining substrate. CONSTITUTION: A light transmission substrate(10) transmits light. An interval maintaining substrate is attached to the bottom surface of the light transmission substrate, including the space part(22) and a pattern. A bum layer is formed in the bottom surfaces of the inside and the outside of the interval maintaining substrate so as to electrically conduct the pattern of the interval maintaining substrate. The first adhesion unit(30) is attached to the bottom surface of the inside of the bump layer(24). A chip(40) receives and signalizes the light transmitted through the light transmission substrate via a space part, mounted by the first adhesion unit and electrically connected to the first adhesion unit. The second adhesion unit(50) mounts the image sensor on a module to electrically conduct the image sensor, attached to the bottom surface of the outside of the substrate.