| 摘要 |
FIELD: electrical engineering; manufacture of thin-film integrated circuits. ^ SUBSTANCE: method includes uninterrupted removal of film-component material in the form of variable-width continuous cut by laser beam whose focused spot moves over film-component surface and evaporates its material until desired rating is attained. Beam is stopped down and set in oscillatory motion, its amplitude being gradually reduced as parameter being adjusted approaches desired rating; in the process laser beam modulation rate, its motion speed along cut line, and spot size are chosen so as to maintain continuous cut and to ensure that amount of material being removed complies with desired precision. In order to provide for continuous cut in longitudinal direction along current line through resistor, time of laser beam motion over surface being treated is kept longer than or equal to laser beam modulation period and amplitude of modulated oscillations is adjusted. ^ EFFECT: enhanced precision of resistor value adjustment at same time and temperature of thin-film resistor unit. ^ 1 cl, 6 dwg, 1 tbl |
