| 摘要 |
There is provided a chemical treatment apparatus for performing a chemical treatment on a treating surface of a wafer etc. by supplying a chemical via a cell. The cell is constituted by a cylindrical inner cell and a cylindrical outer cell with open ends attached to an outer side of the inner cell. The outer cell is axially movable and arbitrarily varies the width of a slit formed between a bottom end of the outer cell and a top surface of the substrate-holding means by the axial movement, thereby adjusting the discharge rate of the chemical and varying the pressure of the chemical. This permits the realization of rapid supply and replacement of the chemical to through holes, non-through holes or grooves. Even in the case of through holes, non-through holes and grooves having small inside diameters and minimum diameters formed in the substrate and having a high aspect ratio, it is possible to rapidly perform the supply and replacement of the chemical to the inside thereof and to perform high-grade chemical treatment with a minimum consumption of the chemical. |
