发明名称 LAMINATED CHIP INDUCTOR
摘要 PROBLEM TO BE SOLVED: To constitute a laminated chip inductor by which DC overlapping characteristics are improved without a limitation by the length of a magnetic-substance laminate and in which optimum characteristics can be obtained. SOLUTION: A plurality of through-holes 3 are disposed to the magnetic-substance laminate 1, and a plurality of conductor paths 30 are formed by a filling with a conductor. A coil is formed by forming wiring patterns 2a and 2b connected to each conductor path 30 at specified places respectively on the top face and underside of the magnetic-substance laminate 1. The coil is formed by arranging four unidirectional wound-coil constituting sections 11 to 14 in parallel and connecting the constituting sections 11 to 14 in series, and a meandering flux path is formed by making a current flow through the coil. The flux path of an arbitrary length can be formed without the limitation by the length of the magnetic-substance laminate 1 by such a constitution. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193511(A) 申请公布日期 2004.07.08
申请号 JP20020362894 申请日期 2002.12.13
申请人 MURATA MFG CO LTD 发明人 SAKATA KEIJI
分类号 H01F17/00;H01F17/04;(IPC1-7):H01F17/00 主分类号 H01F17/00
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