| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveyor apparatus capable of safely conveying a thin work which is≤100μm thick without any fracture of the work, and easily positioning the work. SOLUTION: The conveyor apparatus is adapted to convey a thin wafer≥100μm thick from its placement position to another position. The conveyor apparatus includes a plate-shaped member 20 provided movably and rotatably, and moving/rotating means for moving and rotating the plate-shaped member 20. The plate-shaped member 20 includes lifting means for lifting a wafer placed at the placement position uniformly as a whole, and holding means for evenly attracting and holding the whole of the wafer lifted by the lifting means to a wafer attraction face 20a of the plate shaped member 20. Further, a plurality of Bernoulli nozzles 30, 30... as the lifting means and a plurality of vacuum attraction nozzles 32, 32... as the holding means are alternately opened toward the wafer attraction face 20a located in the vicinity of an outer circumference of the plate-shaped member 20 along the outer circumference. COPYRIGHT: (C)2004,JPO&NCIPI |
