| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for simultaneously laminating one film on one surface of a metal plate and laminating another film having a different melting point on another surface of the metal plate. SOLUTION: When one film is laminated on one surface of the metal plate and another film is laminated on another surface of the metal plate, the thickness of the film having the lower melting point is adjusted. Concretely, the thickness d2 of the film having the lower melting point clamped between the laminate roll and the metal plate is in the range represented by the formula d2≥k(ΔMP-ΔT)/V whereinΔMP is a difference of melting point between the two kinds of films, k≥2, and 0<ΔT=MP1-ϕTi≤50°C (Ti is a temperature of the metal plate on the inlet side of the roll; V is a velocity of the passing plate; andϕis a constant determined by a heat removing condition during laminating and 0.75≤ϕ<1). Thus, it is possible to prevent the film 2 having the lower melting point from winding around the laminate roll. COPYRIGHT: (C)2004,JPO&NCIPI
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