| 摘要 |
The invention relates to a method and a device for reducing the adhesion tendency during the hot forming of a glass body, using at least two moulds, which are positioned on either side of the glass body and are brought into contact with the glass body at a temperature, at which the glass is deformable, whereby the moulds are configured with electrically conductive surfaces. The disadvantage of existing methods and devices is that the moulds have a tendency to adhere to the glass body to be formed and that the surface quality of the glass is impaired. The invention therefore discloses a method, according to which the conductive surfaces of the moulds that come into contact with the glass body are supplied with an alternating current. The device for carrying out said method has electrically conductive mould surfaces, which are connected to an alternating current source. This guarantees that a larger processing window is available as a result of the reduced adhesion tendency, i.e. a greater flexibility in, for example, the temperature, the forming pressure and the duration of contact, achieving an improved glass quality.
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